~A new material to clean up areas, which touch the back side of wafer (contact area ) in the semiconductor manufacturing equipment.
~Clean Wafer within the semiconductor manufacturing equipment can remove particles on the chuck tables.
~Clean wafer is a silicon wafer with the particle removal layer.
History & market result
general properties & mechanism of removing particle
Comparison list
—We co-evaluate with device customer in dry etching process.
—Clean Wafer can improve the operation ratio of equipment.
We confirmed continuous particle removal performance until 3 times repeatability with Clean Wafer.